Where is the live CopyMark page for USPTO serial 75719597?

The live record is at https://getcopymark.com/trademark/75719597. Use https://getcopymark.com/trademark/{serialNumber} for any 8-digit USPTO serial.

Who owns SOLDER COLUMN INTERPOSER?

According to the public USPTO record for serial number 75719597, the listed owner(s) include: NGK Spark Plug Co., Ltd..

What is USPTO serial number 75719597?

Serial number 75719597 is the USPTO application identifier for the mark SOLDER COLUMN INTERPOSER. It is used to track examination, publication, and registration of this trademark.

What is the current status of SOLDER COLUMN INTERPOSER?

SOLDER COLUMN INTERPOSER (75719597) currently shows USPTO status code 603 on the public record. This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

Which trademark classes cover SOLDER COLUMN INTERPOSER?

The public record lists International Classes: 009. Each class corresponds to categories of goods or services identified in the application or registration.

Trademark: SOLDER COLUMN INTERPOSER Serial# 75719597 | status 603; last event EXPT | Trademark Info & Attorney Guidance

What this means

This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

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Owner

NGK Spark Plug Co., Ltd.
Nagoya City, JP
Other trademarks owned by NGK Spark Plug Co., Ltd.

Goods and services

Class	Description	Status	First use
009	Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board	ACTIVE	Jul 1, 1996

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

Date	Code	Event	What it means
Aug 21, 2002	EXPT	EXPARTE APPEAL TERMINATED	—
Feb 4, 2002	ABN3	ABANDONMENT - AFTER EX PARTE APPEAL	—
Feb 4, 2002	EXFB	EXPARTE APPEAL DISMISSED - FAILURE TO FILE BRIEF	—
Jul 2, 2001	CNCF	CONTINUATION OF FINAL REFUSAL MAILED	—
Jun 6, 2001	JURT	JURISDICTION RESTORED TO EXAMINING ATTORNEY	—
Jun 6, 2001	EXPI	EX PARTE APPEAL-INSTITUTED	—
Jan 11, 2001	CNFR	FINAL REFUSAL MAILED	A final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon.
May 18, 2000	CRFA	CORRESPONDENCE RECEIVED IN LAW OFFICE	—
Nov 23, 1999	CNRT	NON-FINAL ACTION MAILED	A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Nov 12, 1999	DOCK	ASSIGNED TO EXAMINER	—
Nov 5, 1999	DOCK	ASSIGNED TO EXAMINER	—

SOLDER COLUMN INTERPOSER