USPTO serial 79425805
XTROLOGY
Reviewed by CopyMark Law Group
Status 681
- Filing date
- Status date
- Registration date
- —
- Examiner
- HAN, DAWN L
- Law office
- PUBLICATION AND ISSUE SECTION
What this means
This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.
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Owner
Goods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 009 | Semiconductor wafer inspection apparatus, namely, inspection machines for the physical inspection of semiconductor wafers; analyzing apparatus for defect of semiconductor wafers, namely, optical spectrum analyzers for analyzing defect of semiconductor wafers; analyzing apparatus for stress of semiconductor wafers, namely, optical spectrum analyzers for analyzing stress of semiconductor wafers; analyzing apparatus for composition of semiconductor wafers, namely, optical spectrum analyzers for analyzing composition of semiconductor wafers; semiconductor wafer measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor wafers; semiconductor wafer testing equipment; semiconductor photomask inspection apparatus, namely, inspection machines for the physical inspection of semiconductor photomask substrates; analyzing apparatus for defect of semiconductor photomasks, namely, optical spectrum analyzers for analyzing defect of semiconductor photomasks; analyzing apparatus for stress of semiconductor photomasks, namely, optical spectrum analyzers for analyzing stress of semiconductor photomasks; analyzing apparatus for composition of semiconductor photomasks, namely, optical spectrum analyzers for analyzing composition of semiconductor photomasks; semiconductor photomask measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor photomasks; semiconductor photomask testing equipment; semiconductor reticle inspection apparatus, namely, inspection machines for the physical inspection of semiconductor reticles; analyzing apparatus for defect of semiconductor reticles, namely, optical spectrum analyzers for analyzing defect of semiconductor reticles; analyzing apparatus for stress of semiconductor reticles, namely, optical spectrum analyzers for analyzing stress of semiconductor reticles; analyzing apparatus for composition of semiconductor reticles, namely, optical spectrum analyzers for analyzing composition of semiconductor reticles; semiconductor reticle measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor reticles; semiconductor reticle testing equipment; semiconductor substrate inspection, namely, inspection machines for the physical inspection of semiconductor substrates; analyzing apparatus for defect of semiconductor substrates; analyzing apparatus for stress of semiconductor substrates, namely, optical spectrum analyzers for analyzing stress of semiconductor substrates; analyzing apparatus for composition of semiconductor substrates namely, optical spectrum analyzers for analyzing composition of semiconductor substrates; semiconductor substrate measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor substrates; semiconductor substrate testing equipment; optical analyzers, namely, optical sensors for mapping semiconductor wafers; Raman spectrographic measurement apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition and shape using Raman spectrometers, not for medical purposes, and structural parts therefor; optical analyzers, namely, Raman spectroscopic analyzing apparatus, not for medical purposes, and structural parts therefor; measuring apparatus, namely, scientific instrumentation for measuring film thickness; measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements using spectral measurements; automated optical inspection apparatus, namely, inspection machines for the physical inspection of semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles; X-ray fluorescence measuring apparatus, namely, scientific instrumentation for measuring semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles using X-ray fluorescence; measuring or testing machines and instruments, namely, inspection machines for the physical inspection of semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles, and structural parts therefor; photoluminescence or fluorescence microscope spectrometers, not for medical purposes, and structural components therefor; optical machines and apparatus, namely, Raman spectrometers, not for medical purposes, photoluminescence spectrometers, not for medical purposes, ellipsometers, interferometric film thickness meters, X-ray fluorescence analyzers, and defect inspection instruments using laser scattering; optical machines and apparatus, namely, microscopes with viewing camera; cinematographic machines and apparatus; laboratory apparatus and instruments, namely, Raman spectrometers for laboratory use, photoluminescence spectrometers for laboratory use, ellipsometers, interferometric film thickness meters, X-ray fluorescence analyzers, and defect inspection instruments using laser scattering; downloadable and recorded computer software for the inspection, defect analysis, stress analysis, composition analysis, measurement and testing of semiconductor wafers, photomasks, reticles and substrates; scanning probe microscopes; X-ray fluorescence analyzing apparatus, namely, X-ray fluorescence analyzers; rotary converters; phase modifiers; batteries and dry cells; electric meters, magnetic electricity meters, and electrical outlet testers; electric wires and cables; spectacles and safety goggles; fire alarms; gas alarms | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Sep 2, 2026 | OP2R | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | — |
| Aug 24, 2026 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Jul 31, 2026 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Jul 31, 2026 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jul 31, 2026 | ERFR | TEAS REQUEST FOR RECONSIDERATION RECEIVED | — |
| Mar 2, 2026 | GNFN | NOTIFICATION OF FINAL REFUSAL EMAILED | — |
| Mar 2, 2026 | GNFR | FINAL REFUSAL E-MAILED | A final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon. |
| Mar 2, 2026 | CNFR | FINAL REFUSAL WRITTEN | A final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon. |
| Jan 29, 2026 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Jan 29, 2026 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jan 29, 2026 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Jan 8, 2026 | ARAA | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Jan 8, 2026 | REAP | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | — |
| Jan 8, 2026 | CHAN | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED | — |
| Jan 8, 2026 | COAR | TEAS CHANGE OF OWNER ADDRESS RECEIVED | — |
| Nov 22, 2025 | RFNT | REFUSAL PROCESSED BY IB | — |
| Oct 30, 2025 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Oct 30, 2025 | RFRR | REFUSAL PROCESSED BY MPU | — |
| Sep 12, 2025 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Sep 11, 2025 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Sep 1, 2025 | DOCK | ASSIGNED TO EXAMINER | — |
| Jun 13, 2025 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Jun 13, 2025 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Jun 12, 2025 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |