Drawing for CAPRAM

USPTO serial 79430208

CAPRAM

Reviewed by CopyMark Law Group

Reg. 8407671Status 700Registered
Filing date
Status date
Registration date
Aug 25, 2026
Examiner
SWIFT, GILBERT M
Law office
FILE REPOSITORY (FRANCONIA)

What this means

Status 700 means the trademark is registered and active on the Principal Register. You have nationwide rights for the listed goods and services and may use ®. Section 8 maintenance is due between years five and six. Calendar Section 8 between years five and six, and consider trademark monitoring.

Status 700: Status 700 means the trademark is registered and active on the Principal Register. You have nationwide rights for the listed goods and services and may use ®. Section 8 maintenance is due between years five and six.

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If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.

Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.

Owner

Goods and services

ClassDescriptionStatusFirst use
001Silicon; semiconductor silicon; chemicals for the manufacture of semiconductors; chemical preparations for the manufacture of electronic components; chemical compositions for the manufacture of computer chips; industrial chemicals for the manufacture of integrated circuits; chemical products for the electronics industry, namely, deposition chemicals, etching chemicals, cleaning chemicals, and surface treatment chemicals for use in flash memory manufacture; chemicals for the manufacture of semiconductor chips; etchants for the manufacture of semiconductors; adhesives for industrial purposes in the form of chips; dopants, namely, boron, phosphorus, arsenic, and antimony, for the manufacture of semiconductors; chemical starting materials, namely silane, tetraethyl orthosilicate, trimethylaluminum, hafnium tetrachloride, and tungsten hexafluoride, for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors; chemical substances, namely silane, tetraethyl orthosilicate, trimethylaluminum, hafnium tetrachloride, and tungsten hexafluoride, for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors.ACTIVE
009Semiconductors; semiconductor devices; semiconductor chips; semiconductor power elements; semiconductor memory devices; semiconductor memory units; computer chipsets; integrated circuit chips; chips, namely, integrated circuits; silicon chips in the nature of electronic components; electronic memory chips in the nature of integrated circuits; computer chipsets for transferring data to and from a central processing unit; recorded computer software for developing integrated circuits; recorded software for operating and managing integrated circuit components; integrated circuit memories; electronic memory circuits in the nature of integrated circuits; integrated circuit memory cards; compilers, namely, downloadable compiler software; downloadable artificial intelligence software; downloadable artificial intelligence software for analysis; downloadable machine learning software; downloadable machine learning software for analysis; memory devices, namely, memory cards; memory modules; downloadable artificial intelligence software for vehicles; volatile memory being computer memory devices; non-volatile memory being computer memory devices; flash memory being computer memory devices; computer memory devices; portable computers; portable computer hardware; portable computer peripherals; portable peripherals for computers portable communication devices, namely, portable AI computing modules, wireless edge inference devices, and portable semiconductor processing units for artificial intelligence applications; mobile computers; augmented reality glasses; augmented reality headsets; hardware for augmented reality, namely, augmented reality processors, augmented reality computing modules, semiconductor chips for use in augmented reality headsets, and augmented reality edge inference accelerators; smart glasses; smartphones; smartwatches; smart rings; blank smart cards; virtual reality glasses; virtual reality hardware, namely, virtual reality processors, virtual reality computing modules, semiconductor chips for use in virtual reality headsets, and virtual reality edge inference accelerator; virtual reality headsets; AI computer hardware; AI chips, namely, semiconductor chips.ACTIVE
040Custom manufacturing of computer chips for others; custom manufacturing of integrated circuits for others; custom manufacturing of semiconductor components, devices and circuits for others; custom manufacturing and assembly services for semiconductor components and integrated circuits for others; custom manufacturing of AI hardware for others; semiconductor processing services, namely, ion implantation services, chemical vapor deposition services, physical vapor deposition services, atomic layer deposition services, photolithography services, and chemical mechanical planarization services for the manufacture of semiconductors; treatment and processing of semiconductors, namely, wafer thinning services, through-silicon via etching services, wafer bonding services, annealing services, and dry etching services for the manufacture of three-dimensional integrated circuits.ACTIVE
042Integrated circuit design; computer hardware design; computer chip design and development; AI hardware design and development; computer hardware development; electronic circuit design engineering services; semiconductor manufacturing technological consulting; silicon photonics chip manufacturing technological research; semiconductor technology research and development; artificial intelligence technology research and development; artificial intelligence technology research; artificial intelligence technology consulting; provision of computer programs, namely, providing online, non-downloadable software for artificial intelligence in data networks; artificial intelligence technology consulting; edge computing research; semiconductor processing technology research; semiconductor processing technology technical consulting; In-memory computing technology development; Software as a Service (SaaS) featuring software for use in optimizing, quantizing, and compressing artificial intelligence as well as edge computing.ACTIVE

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
Aug 25, 2026NRCCNOTICE OF REGISTRATION CONFIRMATION EMAILED
Aug 25, 2026R.PRREGISTERED-PRINCIPAL REGISTERYour trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive.
Jul 7, 2026NPUBOFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Jul 7, 2026PUBOPUBLISHED FOR OPPOSITIONYour mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance.
Jul 1, 2026NONPNOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Jun 9, 2026CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER
Jun 9, 2026TEMETEAS/EMAIL CORRESPONDENCE ENTERED
Jun 9, 2026CRFACORRESPONDENCE RECEIVED IN LAW OFFICE
Jun 9, 2026TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
May 7, 2026LIMGLIMITATION OF GOODS RECEIVED FROM IB
Jan 8, 2026RFNTREFUSAL PROCESSED BY IB
Dec 21, 2025RFCSNON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Dec 21, 2025RFRRREFUSAL PROCESSED BY MPU
Nov 15, 2025RFCRNON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Nov 14, 2025CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Sep 29, 2025DOCKASSIGNED TO EXAMINER
Aug 15, 2025MAFRAPPLICATION FILING RECEIPT MAILED
Aug 15, 2025NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Aug 14, 2025REPRSN ASSIGNED FOR SECT 66A APPL FROM IB

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