CopyMark Law Group
4.9/5
Drawing for QCIA THERMALFABRIC

USPTO serial 50061795

QCIA THERMALFABRIC

Reviewed by CopyMark Law Group

Status 630
Filing date
Status date
Registration date
—
Examiner
—
Law office
—

What this means

Status 630 means your trademark application is in the USPTO queue and has not yet been assigned to an examining attorney. This is normal shortly after filing. Examination typically begins within three to four months, though timing varies. Wait for assignment and the first examiner action. Monitor TSDR monthly for status changes to 638 (assigned) or an office action.

Status 630: Status 630 means your trademark application is in the USPTO queue and has not yet been assigned to an examining attorney. This is normal shortly after filing. Examination typically begins within three to four months, though timing varies.

Need help with QCIA THERMALFABRIC?

If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.

Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Trademark Monitoring
(312) 319-4460
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.
Start a new application
(312) 319-4460

Owner

Attorney of record

The USPTO lists this attorney as the applicant's representative for correspondence on this application.

Daniel R. Frijouf

Daniel R. Frijouf Frijouf, Rust & Pyle, P.A.4601 N. Armenia AvenueTAMPA, FL 33603United States

Goods and services

ClassDescriptionStatusFirst use
009Semiconductor substrates incorporating integrated thermal-management structures; semiconductor substrates supporting heat spreading, heat transport, thermal routing and heat dissipation; silicon and silicon carbide substrates incorporating thermally conductive structures; semiconductor package substrates supporting integrated thermal management and heterogeneous integration; semiconductor substrates incorporating thermal-interface structures, heat-distribution pathways, thermal-routing structures and heat-spreading structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.ACTIVE—

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
Oct 27, 2026NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED—
Aug 20, 2026MAFRAPPLICATION FILING RECEIPT MAILED—
Aug 20, 2026NWAPNEW APPLICATION ENTERED—

Frequently asked questions

Related guidance