USPTO serial 76182003
ACCRETE
Reviewed by CopyMark Law Group
Status 606
- Filing date
- Status date
- Registration date
- —
- Examiner
- AMOS, TANYA L
- Law office
- INTENT TO USE SECTION
What this means
This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.
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Owner
Attorney of record
The USPTO lists this attorney as the applicant's representative for correspondence on this application.
Curtis B Hamre
CURTIS B HAMRE MERCHANT & GOULD PCP O BOX 2910MINNEAPOLIS, MN 55402-0910UNITED STATESGoods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 007 | Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and machine parts therefor | ACTIVE | — |
| 009 | Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units | ACTIVE | — |
| 036 | Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines | ACTIVE | — |
| 037 | Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines | ACTIVE | — |
| 040 | Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines | ACTIVE | — |
| 042 | Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing for coordinate measuring machines; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
- Other trademarks owned by Kabushiki Kaisha Tokyo Seimitsu
- Other trademarks owned by Kabushiki Kaisha Tokyo Seimitsu
- Other trademarks in Class 007
- Other trademarks in Class 009
- Other trademarks in Class 036
- Other trademarks in Class 037
- Other trademarks in Class 040
- Other trademarks in Class 042
- Similar marks named ACCRETE
- Prosecution event MAB6 explained
- Recently changed USPTO trademarks
- Recently filed trademarks
- Browse all trademark records
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Jan 26, 2005 | MAB6 | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | The intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window. |
| Jan 26, 2005 | ABN6 | ABANDONMENT - NO USE STATEMENT FILED | The intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window. |
| Aug 9, 2004 | CFIT | CASE FILE IN TICRS | — |
| Apr 26, 2004 | DOCK | ASSIGNED TO EXAMINER | — |
| Mar 4, 2004 | EX2G | SOU EXTENSION 2 GRANTED | — |
| Feb 19, 2004 | EXT2 | SOU EXTENSION 2 FILED | — |
| Feb 19, 2004 | PAPER RECEIVED | — | |
| Sep 10, 2003 | EX1G | SOU EXTENSION 1 GRANTED | — |
| Aug 18, 2003 | PAPER RECEIVED | — | |
| Aug 13, 2003 | EXT1 | SOU EXTENSION 1 FILED | — |
| Mar 4, 2003 | NOAM | NOA MAILED - SOU REQUIRED FROM APPLICANT | A Notice of Allowance means your intent-to-use application cleared examination and opposition but is not registered yet. You must file a Statement of Use showing the mark in commerce, or request an extension, before the deadline — usually six months from the notice date. |
| Dec 10, 2002 | PUBO | PUBLISHED FOR OPPOSITION | Your mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance. |
| Nov 20, 2002 | NPUB | NOTICE OF PUBLICATION | — |
| Sep 12, 2002 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Jul 15, 2002 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jul 15, 2002 | PAPER RECEIVED | — | |
| Mar 3, 2002 | DOCK | ASSIGNED TO EXAMINER | — |
| Jan 25, 2002 | CNFR | FINAL REFUSAL MAILED | A final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon. |
| Oct 11, 2001 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jun 11, 2001 | CNRT | NON-FINAL ACTION MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jun 11, 2001 | DOCK | ASSIGNED TO EXAMINER | — |
| May 30, 2001 | DOCK | ASSIGNED TO EXAMINER | — |
| Feb 15, 2001 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |