USPTO serial 76328762
KS
Reviewed by CopyMark Law Group
- Filing date
- Status date
- Registration date
- Dec 2, 2003
- Examiner
- KAZAZIAN, MICHAEL H
- Law office
- —
What this means
Status 800 means the registration was renewed after acceptable combined Section 8 and Section 9 filings. The mark remains registered for another 10-year term with active federal protection. Calendar the next Section 8 and 9 deadline in 10 years and maintain monitoring.
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Current trademark owner
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Owner
Kulicke & Soffa Investments, Inc.
Wilmington, DE
Kulicke & Soffa Investments, Inc.
Wilmington, DE
Kulicke & Soffa Investments, Inc.
Wilmington, DE
KULICKE AND SOFFA INDUSTRIES, INC.
FORT WASHINGTON, PA
Other trademarks owned by KULICKE AND SOFFA INDUSTRIES, INC.
KULICKE AND SOFFA INDUSTRIES, INC.
FORT WASHINGTON, PA
Other trademarks owned by KULICKE AND SOFFA INDUSTRIES, INC.
Attorney of record
The USPTO lists this attorney as the applicant's representative for correspondence on this application.
Christopher M. Spletzer, Sr.
1005 Virgina AveFort Washington, PA 19034United StatesGoods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 007 | Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ] | ACTIVE | — |
| 008 | Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders | ACTIVE | — |
| 009 | Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ] | ACTIVE | — |
| 035 | Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times | ACTIVE | — |
| 037 | Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment | ACTIVE | — |
| 040 | [Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors;] [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ] | SECTION 8 - CANCELLED | — |
| 041 | Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ] | ACTIVE | — |
| 042 | Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
- Other trademarks owned by Kulicke & Soffa Investments, Inc.
- Other trademarks owned by Kulicke & Soffa Investments, Inc.
- Other trademarks owned by Kulicke & Soffa Investments, Inc.
- Other trademarks owned by KULICKE AND SOFFA INDUSTRIES, INC.
- Other trademarks owned by KULICKE AND SOFFA INDUSTRIES, INC.
- Other trademarks in Class 007
- Other trademarks in Class 008
- Other trademarks in Class 009
- Other trademarks in Class 035
- Other trademarks in Class 037
- Other trademarks in Class 040
- Other trademarks in Class 041
- Other trademarks in Class 042
- Similar marks named KS
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Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Jun 14, 2024 | NAS8 | NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED | — |
| Jun 14, 2024 | RNL2 | REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) | The trademark registration was renewed for another 10-year term after acceptable maintenance filings. RNL1, RNL2, and RNL3 indicate which renewal cycle (first, second, or third 10-year term) was recorded. The registration remains active. |
| Jun 14, 2024 | 9G8P | REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8 | — |
| Jun 14, 2024 | 8PRT | REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED | — |
| Jun 14, 2024 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| Mar 13, 2024 | E89R | TEAS SECTION 8 & 9 RECEIVED | — |
| Dec 2, 2022 | REM2 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED | — |
| Jan 29, 2018 | ARAA | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Jan 29, 2018 | REAP | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | — |
| Jun 17, 2014 | NA89 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED | — |
| Jun 17, 2014 | RNL1 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) | The trademark registration was renewed for another 10-year term after acceptable maintenance filings. RNL1, RNL2, and RNL3 indicate which renewal cycle (first, second, or third 10-year term) was recorded. The registration remains active. |
| Jun 17, 2014 | 89AG | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED | The USPTO accepted your combined Section 8 declaration and Section 9 renewal application. The registration is renewed for another 10-year term. The next combined maintenance filing will be due at the following 10-year anniversary. |
| Jun 17, 2014 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| May 30, 2014 | E89R | TEAS SECTION 8 & 9 RECEIVED | — |
| Jan 4, 2010 | C15A | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. | — |
| Dec 16, 2009 | ASGN | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | — |
| Dec 11, 2009 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| Dec 9, 2009 | ASGN | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | — |
| Dec 2, 2009 | E815 | TEAS SECTION 8 & 15 RECEIVED | — |
| Dec 2, 2009 | FAXX | FAX RECEIVED | — |
| Dec 3, 2003 | EXPT | EXPARTE APPEAL TERMINATED | — |
| Dec 2, 2003 | R.PR | REGISTERED-PRINCIPAL REGISTER | Your trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive. |
| Sep 9, 2003 | PUBO | PUBLISHED FOR OPPOSITION | Your mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance. |
| Aug 20, 2003 | NPUB | NOTICE OF PUBLICATION | — |
| Jun 30, 2003 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| May 21, 2003 | CFIT | CASE FILE IN TICRS | — |
| May 20, 2003 | CFIT | CASE FILE IN TICRS | — |
| May 13, 2003 | JURT | JURISDICTION RESTORED TO EXAMINING ATTORNEY | — |
| Apr 29, 2003 | EXPI | EX PARTE APPEAL-INSTITUTED | — |
| Apr 25, 2003 | EXAF | EXPARTE APPEAL RECEIVED AT TTAB | — |
| Apr 11, 2003 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Apr 11, 2003 | PAPER RECEIVED | — | |
| Oct 10, 2002 | CNFR | FINAL REFUSAL MAILED | A final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon. |
| Oct 9, 2002 | DOCK | ASSIGNED TO EXAMINER | — |
| Sep 27, 2002 | DOCK | ASSIGNED TO EXAMINER | — |
| Aug 26, 2002 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Aug 26, 2002 | PAPER RECEIVED | — | |
| Feb 25, 2002 | CNRT | NON-FINAL ACTION MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Feb 22, 2002 | DOCK | ASSIGNED TO EXAMINER | — |
| Dec 14, 2001 | AMPX | PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED | — |
| Dec 14, 2001 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |