Drawing for PROACT

USPTO serial 77136102

PROACT

Reviewed by CopyMark Law Group

Status 606
Filing date
Status date
Registration date
—
Examiner
RAUEN, JAMES
Law office
INTENT TO USE SECTION

What this means

This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

Need help with PROACT?

If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.

Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.

Owner

Attorney of record

The USPTO lists this attorney as the applicant's representative for correspondence on this application.

Steven J. Hultquist

STEVEN J. HULTQUIST INTELLECTUAL PROPERTY/TECHNOLOGY LAWPO BOX 14329RESEARCH TRIANGLE PARK, NC 27709-4329UNITED STATES

Goods and services

ClassDescriptionStatusFirst use
001chemical reagents for non-medical purposes; chemical compositions capable of undergoing change by processing to yield chemical products for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; solvent compositions for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; doping compounds for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; chemical compositions that yield decomposition products or reaction products in processes employing same, for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; etchants for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; photoresists; chemicals for use in electrochemical deposition processes in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; metal plating chemical compositions; gases used for deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation, and annealing, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; materials used for deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation, and annealing, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; doping compound gases and chemical vapor deposition precursor gases for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; chemicals for use in treating hazardous gases produced in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits, to reduce the hazardous character of such gases; chemical source materials for the deposition of thin films in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; organometallic chemicals for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; ion implantation precursors for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; chemicals for use in chemical reagent delivery systems for use in the manufacture of microelectronic products, semiconductors, digital storage media and flat-panel displays; gases provided in a gas supply container holding adsorbent material on which the gas is adsorbed, for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits, for deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation, and annealing; gaseous chemicals in vapor or liquid form, for use in deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation and annealing, in the manufacture of microelectronic products, semiconductors, flat-panel displays, integrated circuits and in testing and qualification thereof; consumable solid, liquid and gaseous chemical compositions and cleaning compositions for use in the manufacture of semiconductors and flat panels; gases adsorbed on adsorbents in gas supply containers for sub-atmospheric pressure gas dispensing, for use in deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation and annealing, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; solid adsorbents for use in storage and dispensing of gases for use in deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation and anneling, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; ionic liquid storage media for use in storage and dispensing of gases for use in deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation and annealing, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; chemical storage media for use in storage and dispensing of gases for use in deposition, etching, lithography, planarization, plasma treatment, ashing, cleaning, ion implantation and annealing, in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; solid and liquid chemicals provided in a vapor supply container for use in generating vapor for manufacture of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; chemical compositions useful for removing microelectronics manufacturing fabrication materials from microelectronic products such as wafers and microelectronic devices, that are rejected after such microelectronics manufacturing fabrication materials have been deposited on them, and that are recycled following the removal of such materials; adsorbent materials having industrial gases adsorbed thereonACTIVE—
003cleaning compositions for subatmospheric pressure cleaning of commercial vacuum equipment; chemical cleaners for use in cleaning of equipment for manufacture of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; cleaning preparations for removing unwanted deposits and extraneous materials from semiconductor device substrates during the manufacture of microelectronic products; solid/liquid abrasive slurries used for planarizing surfaces in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; polishing preparations used for finish processing of surfaces in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; cleaning preparations for removing unwanted deposited material and contaminants from wafers and partially finished substrates of microelectronic products so that they can be recycled for finishingACTIVE—
006empty metallic containers for storing and delivering chemicals and liners therefor; manually operated metal inlet, outlet, and refill valves; manually operated metal manifolds for transferring chemicals; pipes and tubes of metal for transferring chemicals; empty metal canisters for chemical delivery and empty metal chemical refill canisters for holding chemicals for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; manual metal inlet and outlet valves, manifolds, pipes, tubes and metal pipes, conduits, manifolds, couplings, fittings and joints, for filling, packaging, storage and delivery of chemicals; metal chemical delivery equipment, namely, empty metal chemical containers and conduits, for use in the manufacture, testing and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; empty metal gas supply containers for holding adsorbent material on which adsorbed gas is stored and from which gas is desorbed for dispensing from the container; empty metal gas supply containers for holding solid or liquid material from which gas or vapor is generated for dispensing from the container; gas supply equipment for storing gases and dispensing such gases on demand, namely, empty metal containers for holding the gas in a pressurized or liquid form and regulators sold as a unit therewith, for on-demand dispensing of such gas; empty metal containers utilizing internal heat transfer components, for storage of chemical source materials and delivery of vapor-phase material therefrom for use in cleaning of semiconductor manufacturing equipment; empty metal containers for chemical storage; empty metal containers for gas supply; empty metal containers for chemical storage and dispensing; metal conduits; manual metal valves; empty metal chemical storage and dispensing containers with internal plastic liners for holding flowable materials for subsequent dispensingACTIVE—
007semiconductor manufacturing machines; semiconductor wafer processing equipment; cleaning machines for cleaning parts from commercial vacuum equipment; pneumatic valvesACTIVE—
009computer hardware and custom software installed in such computer hardware, for use in the manufacture, testing and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; computer hardware and customer software installed in such computer hardware for monitoring and control applications in the manufacture, testing and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; process and product monitors for sensing and output of sensed information to characterize the process and product, process and product analyzers for output of analytical information to characterize the process and product, and electrical and pneumatic controllers for use in manufacturing, testing and qualifying microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems; process and product analyzers for non-destructively characterizing semiconductor materials and non-destructively monitoring semiconductor manufacturing processes; monitors for semiconductor manufacturing processes, namely, sensors and analyzers; substrates for microelectronic products, namely, wafers, and base structures including wafers and epitaxial thin films; equipment for delivering chemicals, and chemical refill equipment, namely, dispensers, electrical and pneumatic flow controllers, and valves, for use in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; equipment for storing and dispensing industrial solids, liquids and gases, namely, dispensers, electrical and pneumatic flow controllers, and electrical valves; liquid chemical detectors, namely, sensors for detection of liquid chemicals, chemical liquid level detectors, colorimetric detectors of chemical liquids, and endpoint detectors for determining exhaustion of liquid chemical in dispensing operations, flow circuitry, and liquid chemical dispensers for pressure-mediated dispensing of liquid chemicals; radio frequency identification systems comprised of readers, tags and software for identifying and tracking chemical containers and dispensers; manual, pneumatic and electrical gas flow controllers; gas flow monitors; cleaning equipment for cleaning commercial components and surfaces in a vacuum chamber using cleaning compositions under subatmospheric pressure conditions, or for in situ cleaning of components and surfaces of commercial vacuum equipment installations using cleaning compositions under subatmospheric pressure conditions, comprising computer software and electronic controls to enable automation of entire cleaning process, vacuum chambers and pumps, tubing, valves, pressure transducers and optional sensors; automatic valves, control valves for regulating the flow of gases and liquids, and electronic valves for controlling gas or fluids; dispensed material flow monitors; monitors for use in monitoring effluents for subsequent treatment, which are generated in the manufacture of microelectronic products, semiconductors, digital storage media, flat-panel displays, and integrated circuits; polymeric film bioreactors for research, development and production applications in the life sciences, biotech and pharmaceutical industriesACTIVE—
016disposable plastic and synthetic bags for material containment, transfer and dispensing; plastic bags for containment and delivery of materialsACTIVE—
020plastic containers for liquid chemicals, liners therefor, and dispensers for use therewith, all for commercial use; metal chemical delivery cabinets for housing metal containers, valves, manifolds and pipes of metal; polymeric film mixing vessels for research, development and production applications in the life sciences, biotech and pharmaceutical industriesACTIVE—
035technical consultation and support services in the nature of product information provided by telecommunications interaction and in person, relating to equipment, processes, materials and technology for manufacturing, testing, packaging and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems by othersACTIVE—
037cleaning services for microelectronics manufacturing, namely, cleaning of wafers previously used for monitoring of semiconductor manufacturing equipment and processes, reworking of product wafers, cleaning of product wafers and monitor wafers, and cleaning of machines and machine parts coated with microelectronics manufacturing fabrication materialsACTIVE—
040custom manufacturing of equipment, materials and process systems for manufacturing, testing, packaging and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems by others; recycling services for microelectronics manufacturing, namely, recycling of wafers previously used for monitoring of semiconductor manufacturing equipment and processes; technical consultation services relating to equipment, processes, materials and technology for manufacturing microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems by others; consulting services related to manufacturing microelectronic products, semiconductors, flat-panel displays, integrated circuit displays, integrated circuits, electronic systems and subsystems by othersACTIVE—
042technical support services in the nature of troubleshooting and engineering design, relating to testing, packaging and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems by others; design and engineering services related to testing, packaging and qualification of microelectronic products, semiconductors, flat-panel displays, integrated circuits, electronic systems and subsystems by othersACTIVE—

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

Latest event (MAB6): The intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window.

DateCodeEventWhat it means
Aug 3, 2009MAB6ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILEDThe intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window.
Aug 3, 2009ABN6ABANDONMENT - NO USE STATEMENT FILEDThe intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window.
Dec 30, 2008NOAMNOA MAILED - SOU REQUIRED FROM APPLICANTA Notice of Allowance means your intent-to-use application cleared examination and opposition but is not registered yet. You must file a Statement of Use showing the mark in commerce, or request an extension, before the deadline — usually six months from the notice date.
Oct 7, 2008PUBOPUBLISHED FOR OPPOSITIONYour mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance.
Sep 17, 2008NPUBNOTICE OF PUBLICATION—
Sep 3, 2008PREVLAW OFFICE PUBLICATION REVIEW COMPLETED—
Aug 27, 2008CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER—
Aug 26, 2008XAECEXAMINER'S AMENDMENT ENTERED—
Aug 26, 2008GNENNOTIFICATION OF EXAMINERS AMENDMENT E-MAILED—
Aug 26, 2008GNEAEXAMINERS AMENDMENT E-MAILED—
Aug 26, 2008CNEAEXAMINERS AMENDMENT -WRITTEN—
Jul 30, 2008EXPTEXPARTE APPEAL TERMINATED—
Jul 9, 2008ZZZXPREVIOUS ALLOWANCE COUNT WITHDRAWN—
Jun 23, 2008PBCRWITHDRAWN FROM PUB - OG REVIEW QUERY—
Jun 9, 2008PREVLAW OFFICE PUBLICATION REVIEW COMPLETED—
Jun 9, 2008CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER—
Jun 6, 2008XAECEXAMINER'S AMENDMENT ENTERED—
Jun 6, 2008GNENNOTIFICATION OF EXAMINERS AMENDMENT E-MAILED—
Jun 6, 2008GNEAEXAMINERS AMENDMENT E-MAILED—
Jun 6, 2008CNEAEXAMINERS AMENDMENT -WRITTEN—
May 19, 2008TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
May 19, 2008CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
May 16, 2008ALIEASSIGNED TO LIE—
May 15, 2008ERFRTEAS REQUEST FOR RECONSIDERATION RECEIVED—
May 15, 2008EXPIEX PARTE APPEAL-INSTITUTED—
May 15, 2008JURTJURISDICTION RESTORED TO EXAMINING ATTORNEY—
May 15, 2008EXAFEXPARTE APPEAL RECEIVED AT TTAB—
Nov 15, 2007GNFNNOTIFICATION OF FINAL REFUSAL EMAILED—
Nov 15, 2007GNFRFINAL REFUSAL E-MAILEDA final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon.
Nov 15, 2007CNFRFINAL REFUSAL WRITTENA final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon.
Oct 25, 2007TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
Oct 24, 2007CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
Oct 24, 2007TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
Apr 24, 2007GNRTNON-FINAL ACTION E-MAILEDA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Apr 24, 2007CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Apr 20, 2007DOCKASSIGNED TO EXAMINER—
Mar 27, 2007MPMKNOTICE OF PSEUDO MARK MAILED—
Mar 26, 2007NWAPNEW APPLICATION ENTERED—

Frequently asked questions

Related guidance