Drawing for ALCSP

USPTO serial 79070214

ALCSP

Reviewed by CopyMark Law Group

Reg. 3856878Status 404
Filing date
Status date
Registration date
Oct 5, 2010
Examiner
MARCY, AMY ALFIERI
Law office
PUBLICATION AND ISSUE SECTION

What this means

This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

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Owner

Attorney of record

The USPTO lists this attorney as the applicant's representative for correspondence on this application.

JEFFREY H. KAUFMAN

JEFFREY H. KAUFMAN Oblon, McClelland, Maier & Neustadt, L.L.P1940 Duke StreetAlexandria, VA 22314UNITED STATES

Goods and services

ClassDescriptionStatusFirst use
009Semiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions, digital audio players, digital still cameras, optical and magneto-optical disc players and records digital video cameras, DVD recorder/players, HDD recorders, telephones, fax machines, mobile phones, car audio equipment, car navigation computers, and personal navigation computers; integrated circuit modules; integrated circuit packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); semiconductor memory; dynamic random access memory; semiconductor memory units; dynamic random access memory modules; electronic circuits; large scale integrated circuits; semiconductor wafers; integrated circuit (IC) memories, namely, semi-conductor memory units for integrated circuits; computer software for designing of integrated circuitsSECTION 71 - CANCELLED—
040Assembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured semiconductor wafersSECTION 71 - CANCELLED—
042Design for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuits; design for others in the field of semi-conductors, semiconductor power elements and integrated circuits; providing on-line non-downloadable computer programs for designing of processing technology, processing devices and electric circuit modeling of integrated circuits, namely, software for use in the design and manufacture of integrated circuits; providing information about product development and design for others in the field of semiconductor integrated circuits; providing information about inspection of semi-conductors; providing information about designing of semi-conductors for others; advisory and consultancy services relating to the designing of integrated circuits for others; product research and development and design for others in the field of semiconductor elements, integrated circuit and electronic circuits, advisory, consultancy and information services relating to product research and development and design for others in the field of semiconductor elements, integrated circuits and electronic circuitsSECTION 71 - CANCELLED—

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
Jul 12, 2019DENCNOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED—
Jul 12, 2019DETHDEATH OF INTERNATIONAL REGISTRATION—
Feb 23, 2018INNTTOTAL INVALIDATION PROCESSED BY THE IB—
Jan 24, 2018INTSTOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB—
Jan 24, 2018INPCINVALIDATION PROCESSED—
Jan 12, 2018INTRTOTAL INVALIDATION OF REG EXT PROTECTION CREATED—
May 12, 2017C71TCANCELLED SECTION 71—
Oct 5, 2015REM3COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED—
Feb 11, 2015TCCATEAS CHANGE OF CORRESPONDENCE RECEIVED—
Feb 12, 2013FINOFINAL DECISION TRANSACTION PROCESSED BY IB—
Jan 10, 2011FICSFINAL DISPOSITION NOTICE SENT TO IB—
Jan 6, 2011FIMPFINAL DISPOSITION PROCESSED—
Jan 5, 2011FICRFINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB—
Oct 5, 2010R.PRREGISTERED-PRINCIPAL REGISTERYour trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive.
Jul 20, 2010NPUBOFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED—
Jul 20, 2010PUBOPUBLISHED FOR OPPOSITIONYour mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance.
Jun 15, 2010PREVLAW OFFICE PUBLICATION REVIEW COMPLETED—
Jun 14, 2010CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER—
Jun 8, 2010TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
Jun 8, 2010CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
Jun 8, 2010ERFRTEAS REQUEST FOR RECONSIDERATION RECEIVED—
Mar 26, 2010GNFNNOTIFICATION OF FINAL REFUSAL EMAILED—
Mar 26, 2010GNFRFINAL REFUSAL E-MAILEDA final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon.
Mar 26, 2010CNFRFINAL REFUSAL WRITTENA final Office Action (final refusal) means the examining attorney is maintaining at least one refusal and your options are narrower. You can file a response addressing the refusal, appeal to the Trademark Trial and Appeal Board, or let the application abandon.
Mar 3, 2010TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
Mar 3, 2010CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
Mar 3, 2010ALIEASSIGNED TO LIE—
Feb 5, 2010TCCATEAS CHANGE OF CORRESPONDENCE RECEIVED—
Feb 5, 2010TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
Sep 4, 2009RFNTREFUSAL PROCESSED BY IB—
Aug 7, 2009RFCSNON-FINAL ACTION MAILED - REFUSAL SENT TO IB—
Aug 6, 2009RFRRREFUSAL PROCESSED BY MPU—
Aug 6, 2009RFCRNON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW—
Aug 5, 2009CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Jul 31, 2009MAFRAPPLICATION FILING RECEIPT MAILED—
Jul 27, 2009DOCKASSIGNED TO EXAMINER—
Jul 27, 2009NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED—
Jul 24, 2009LIMSLIMITATION OF GOODS/SERVICES FROM IB ENTERED—
Jul 23, 2009REPRSN ASSIGNED FOR SECT 66A APPL FROM IB—

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