Drawing for WONIK IPS

USPTO serial 79102249

WONIK IPS

Reviewed by CopyMark Law Group

Reg. 4204098Status 404
Filing date
Status date
Registration date
Sep 11, 2012
Examiner
FINE, STEVEN
Law office
GENERIC WEB UPDATE

What this means

This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

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Owner

Goods and services

ClassDescriptionStatusFirst use
007Semiconductor manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, coupled plasma chemical vapor deposition apparatus, atomic layer deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, annealing apparatus, rapid thermal processing apparatus, low temperature annealing apparatus, coupled sputtering apparatus, multiple sputtering apparatus, laser sublimation deposition apparatus, organic molecular chemical vapor deposition apparatus, ion beam generation apparatus, ion beam sputter deposition apparatus, ion beam etching apparatus, ion beam assisted deposition apparatus, electron beam assisted deposition apparatus, electron beam crystallization apparatus, electron beam annealing apparatus, oxidation mechanical apparatus, ion implantation apparatus, chemical vapor precipitation mechanical apparatus, sputtering mechanical apparatus, and probe [; liquid crystal display manufacturing equipment, namely, film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus, sputtering mechanical apparatus, and probe; organic electroluminescence display manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus; plasma display panel manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, and annealing apparatus; solar cell manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, rapid thermal processing apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus; light emitting diode (LED) manufacturing equipment, namely, thin film deposition apparatus, chemical vapor deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, electron beam annealing apparatus; microelectromechanical systems (MEMS) manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, evaporation deposition apparatus and chemical vapor deposition apparatus; active matrix organic light emitting diode (AMOLED) display manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus and ion beam annealing apparatus ]SECTION 71 - CANCELLED—
037Installation, repair and maintenance of semiconductor processing machines, semiconductor wafer processing apparatus [, atomic layer deposition apparatus, low pressure chemical vapor deposition apparatus, diffusion furnaces, plasma chemical vapor deposition apparatus, metal organic chemical vapor deposition apparatus, fast-heating processing apparatus, high temperature chemical vapor deposition apparatus, vapor epitaxy apparatus, liquid epitaxy apparatus, normal pressure chemical vapor deposition apparatus, mid pressure chemical vapor deposition apparatus, etchers, sputtering apparatus, photolithography apparatus, developers, ashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of semiconductors; installation, repair and maintenance of deposition apparatus etchers, sputtering apparatus, photolithography apparatus, developers, ashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of liquid crystal display panels; installation, repair and maintenance of deposition apparatus, etchers for manufacturing solar cells, sputtering apparatus, photolithography apparatus, developers for manufacturing solar cells, ashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of solar cells; maintenance of deposition apparatus, etchers, sputtering apparatus, photolithography apparatus, developers, ashing apparatus, cleaning apparatus, and polishing apparatus, all for the manufacture of LED and AMOLED displays ]SECTION 71 - CANCELLED—

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CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
Oct 3, 2021DENCNOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED—
Oct 3, 2021DETHDEATH OF INTERNATIONAL REGISTRATION—
Jul 3, 2020INNTTOTAL INVALIDATION PROCESSED BY THE IB—
Jun 4, 2020INTSTOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB—
Jun 4, 2020INPCINVALIDATION PROCESSED—
Apr 18, 2020INTRTOTAL INVALIDATION OF REG EXT PROTECTION CREATED—
Aug 20, 2019NC71NOTICE OF CANCELLATION SEC. 71 E-MAILED—
Aug 18, 2019C71TCANCELLED SECTION 71—
Apr 16, 2019INNAINVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE—
Mar 31, 2019INPRPARTIAL INVALIDATION OF REG EXT PROTECTION CREATED—
Feb 11, 2019PR71POST REGISTRATION ACTION MAILED - SEC.71—
Feb 7, 2019APRECASE ASSIGNED TO POST REGISTRATION PARALEGAL—
Jan 31, 2019EROPTEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED—
Jan 31, 2019EROPTEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED—
Jul 31, 2018PR71POST REGISTRATION ACTION MAILED - SEC.71—
May 8, 2018APRECASE ASSIGNED TO POST REGISTRATION PARALEGAL—
Apr 27, 2018ES71TEAS SECTION 71 RECEIVED—
Oct 16, 2017CORNCORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED—
Oct 13, 2017CRCVCORRECTION TRANSACTION RECEIVED FROM IB—
Sep 11, 2017REM3COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED—
Jul 21, 2016CHLDCHANGE OF OWNER RECEIVED FROM IB—
Aug 17, 2015LIMNLIMITATION FROM THE IB EXAMINED, NO ACTION IS NEEDED—
Jul 31, 2015LIMGLIMITATION OF GOODS RECEIVED FROM IB—
May 6, 2013FINOFINAL DECISION TRANSACTION PROCESSED BY IB—
Apr 16, 2013FICSFINAL DISPOSITION NOTICE SENT TO IB—
Apr 16, 2013FIMPFINAL DISPOSITION PROCESSED—
Dec 11, 2012FICRFINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB—
Dec 2, 2012GPNXNOTIFICATION PROCESSED BY IB—
Sep 11, 2012R.PRREGISTERED-PRINCIPAL REGISTERYour trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive.
Jun 26, 2012NPUBOFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED—
Jun 26, 2012PUBOPUBLISHED FOR OPPOSITIONYour mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance.
Jun 6, 2012OPNSNOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB—
Jun 6, 2012OP2RNOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB—
Jun 6, 2012NONPNOTIFICATION OF NOTICE OF PUBLICATION E-MAILED—
May 21, 2012PREVLAW OFFICE PUBLICATION REVIEW COMPLETED—
May 11, 2012CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER—
May 11, 2012XAECEXAMINER'S AMENDMENT ENTERED—
May 11, 2012GNENNOTIFICATION OF EXAMINERS AMENDMENT E-MAILED—
May 11, 2012GNEAEXAMINERS AMENDMENT E-MAILED—
May 11, 2012CNEAEXAMINERS AMENDMENT -WRITTEN—
Apr 19, 2012TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
Apr 19, 2012CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
Apr 6, 2012TCCATEAS CHANGE OF CORRESPONDENCE RECEIVED—
Apr 6, 2012TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
Dec 30, 2011ADCHCHANGE OF NAME/ADDRESS REC'D FROM IB—
Oct 30, 2011RFNTREFUSAL PROCESSED BY IB—
Oct 19, 2011CHANAPPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED—
Oct 13, 2011ALIEASSIGNED TO LIE—
Oct 12, 2011FAXXFAX RECEIVED—
Oct 11, 2011RFCSNON-FINAL ACTION MAILED - REFUSAL SENT TO IB—
Oct 11, 2011RFRRREFUSAL PROCESSED BY MPU—
Oct 10, 2011RFCRNON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW—
Oct 9, 2011CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Oct 4, 2011MAFRAPPLICATION FILING RECEIPT MAILED—
Sep 30, 2011DOCKASSIGNED TO EXAMINER—
Sep 30, 2011NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED—
Sep 29, 2011REPRSN ASSIGNED FOR SECT 66A APPL FROM IB—

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