USPTO serial 79103531
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| Class | Description | Status | First use |
|---|---|---|---|
| 007 | Semiconductor manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, coupled plasma chemical vapor deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * [, atomic layer deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, annealing apparatus, rapid thermal processing apparatus, ] low temperature annealing apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * [, coupled sputtering apparatus, ] multiple sputtering apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * laser sublimation deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * organic molecular chemical vapor deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * ion beam generation apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * ion beam sputter deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * [, ion beam etching apparatus, ] ion beam assisted deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * electron beam assisted deposition apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * electron beam crystallization apparatus * for manufacturing LCD/PP/semiconductor/LCD/solar cells/GAMBOLED display/LED; * [, electron beam annealing apparatus, ] oxidation mechanical apparatus, ion implantation apparatus, chemical vapor precipitation mechanical apparatus, sputtering mechanical apparatus, and probe [ ; liquid crystal display manufacturing equipment, namely, film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus, sputtering mechanical apparatus, and probe; organic electrocutions display manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus; plasma display panel manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, and annealing apparatus; solar cell manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, rapid thermal processing apparatus, ion beam deposition apparatus, ion beam etching apparatus and annealing apparatus; light emitting diode (LED) manufacturing equipment, namely, thin film deposition apparatus, chemical vapor deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus, ion beam etching apparatus, electron beam annealing apparatus; micro electromechanical systems (ME MS) manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, evaporation deposition apparatus and chemical vapor deposition apparatus; active matrix light emitting diode (GAMBOLED) display manufacturing equipment, namely, thin film deposition apparatus, sputtering apparatus, coupled sputtering apparatus, etching apparatus, evaporation deposition apparatus, plasma chemical vapor deposition apparatus, ion beam deposition apparatus and ion beam annealing apparatus ] | ACTIVE | — |
| 037 | Installation, repair and maintenance of semiconductor processing machines, semiconductor wafer processing apparatus, atomic layer deposition apparatus, low pressure chemical vapor deposition apparatus, diffusion furnaces, plasma chemical vapor deposition apparatus, metal organic chemical vapor deposition apparatus, fast-heating processing apparatus, high temperature chemical vapor deposition apparatus, vapor Keita apparatus, liquid Keita apparatus, normal pressure chemical vapor deposition apparatus, mid pressure chemical vapor deposition apparatus, etchers, sputtering apparatus, photolithography apparatus, developers, bashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of semiconductors [ ; installation, repair and maintenance of deposition apparatus etchers, sputtering apparatus, photolithography apparatus, developers, bashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of liquid crystal display panels; installation, repair and maintenance of deposition apparatus, etchers for manufacturing solar cells, sputtering apparatus, photolithography apparatus, developers for manufacturing solar cells, bashing apparatus, cleaning apparatus and polishing apparatus, all for the manufacture of solar cells; maintenance of deposition apparatus, etchers, sputtering apparatus, photolithography apparatus, developers, bashing apparatus, cleaning apparatus, and polishing apparatus, all for the manufacture of LED and GAMBOLED displays ] | ACTIVE | — |
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
| Date | Code | Event | What it means |
|---|---|---|---|
| Dec 18, 2023 | INNP | PARTIAL INVALIDATION PROCESSED BY THE IB | — |
| Nov 16, 2023 | INPS | PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB | — |
| Nov 16, 2023 | INPC | INVALIDATION PROCESSED | — |
| Nov 11, 2023 | INPR | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | — |
| Mar 11, 2023 | NA71 | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED | — |
| Mar 11, 2023 | 71AG | REGISTERED-SEC.71 ACCEPTED | — |
| Mar 11, 2023 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| Oct 7, 2022 | CHLD | CHANGE OF OWNER RECEIVED FROM IB | — |
| Sep 8, 2022 | ES71 | TEAS SECTION 71 RECEIVED | — |
| Sep 11, 2021 | REM4 | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED | — |
| Apr 30, 2021 | RNWL | INTERNATIONAL REGISTRATION RENEWED | — |
| Dec 17, 2019 | INNA | INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE | — |
| Nov 27, 2019 | INPR | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | — |
| May 3, 2019 | INNP | PARTIAL INVALIDATION PROCESSED BY THE IB | — |
| Mar 27, 2019 | INPS | PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB | — |
| Mar 27, 2019 | INPC | INVALIDATION PROCESSED | — |
| Feb 22, 2019 | INPR | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | — |
| Jun 22, 2018 | NA71 | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED | — |
| Jun 22, 2018 | 71AG | REGISTERED-SEC.71 ACCEPTED | — |
| May 11, 2018 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| Apr 30, 2018 | ES71 | TEAS SECTION 71 RECEIVED | — |
| Nov 16, 2017 | LIMN | LIMITATION FROM THE IB EXAMINED, NO ACTION IS NEEDED | — |
| Oct 23, 2017 | CORN | CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED | — |
| Oct 23, 2017 | CORN | CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED | — |
| Oct 16, 2017 | CORN | CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED | — |
| Oct 13, 2017 | CRCV | CORRECTION TRANSACTION RECEIVED FROM IB | — |
| Oct 13, 2017 | CRCV | CORRECTION TRANSACTION RECEIVED FROM IB | — |
| Oct 13, 2017 | CRCV | CORRECTION TRANSACTION RECEIVED FROM IB | — |
| Oct 13, 2017 | LIMG | LIMITATION OF GOODS RECEIVED FROM IB | — |
| Sep 11, 2017 | REM3 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED | — |
| Jul 21, 2016 | CHLD | CHANGE OF OWNER RECEIVED FROM IB | — |
| Jul 5, 2016 | INNA | INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE | — |
| Jul 5, 2016 | INPR | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | — |
| Nov 6, 2015 | LIME | LIMITATION FROM THE IB EXAMINED AND ENTERED | — |
| Nov 5, 2015 | COC. | CORRECTION UNDER SECTION 7 - PROCESSED | — |
| Nov 5, 2015 | APRE | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | — |
| Jul 31, 2015 | LIMG | LIMITATION OF GOODS RECEIVED FROM IB | — |
| Jan 7, 2013 | FINO | FINAL DECISION TRANSACTION PROCESSED BY IB | — |
| Dec 17, 2012 | FICS | FINAL DISPOSITION NOTICE SENT TO IB | — |
| Dec 17, 2012 | FIMP | FINAL DISPOSITION PROCESSED | — |
| Dec 11, 2012 | FICR | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | — |
| Dec 10, 2012 | GPNX | NOTIFICATION PROCESSED BY IB | — |
| Sep 11, 2012 | R.PR | REGISTERED-PRINCIPAL REGISTER | Your trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive. |
| Jun 26, 2012 | NPUB | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | — |
| Jun 26, 2012 | PUBO | PUBLISHED FOR OPPOSITION | Your mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance. |
| Jun 6, 2012 | OPNS | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | — |
| Jun 6, 2012 | OP2R | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | — |
| Jun 6, 2012 | NONP | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | — |
| May 21, 2012 | PREV | LAW OFFICE PUBLICATION REVIEW COMPLETED | — |
| May 14, 2012 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Apr 19, 2012 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Apr 19, 2012 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Apr 13, 2012 | ALIE | ASSIGNED TO LIE | — |
| Apr 3, 2012 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Apr 3, 2012 | TCCA | TEAS CHANGE OF CORRESPONDENCE RECEIVED | — |
| Dec 30, 2011 | ADCH | CHANGE OF NAME/ADDRESS REC'D FROM IB | — |
| Dec 19, 2011 | RFNT | REFUSAL PROCESSED BY IB | — |
| Nov 15, 2011 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Nov 15, 2011 | RFRR | REFUSAL PROCESSED BY MPU | — |
| Nov 15, 2011 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Nov 14, 2011 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Nov 14, 2011 | FAXX | FAX RECEIVED | — |
| Nov 8, 2011 | RFWR | NON-FINAL ACTION (IB REFUSAL) WITHDRAWN FOR REVIEW | — |
| Nov 5, 2011 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Nov 4, 2011 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Nov 1, 2011 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Oct 28, 2011 | DOCK | ASSIGNED TO EXAMINER | — |
| Oct 28, 2011 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Oct 27, 2011 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |