USPTO serial 79364266
BONDTECH
Reviewed by CopyMark Law Group
- Filing date
- Status date
- Registration date
- Oct 8, 2024
- Examiner
- MONINGHOFF, KIM TERESA
- Law office
- FILE REPOSITORY (FRANCONIA)
What this means
Status 700 means the trademark is registered and active on the Principal Register. You have nationwide rights for the listed goods and services and may use ®. Section 8 maintenance is due between years five and six. Calendar Section 8 between years five and six, and consider trademark monitoring.
Need help with BONDTECH?
If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.
Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.
Owner
Attorney of record
The USPTO lists this attorney as the applicant's representative for correspondence on this application.
Shintaro Yamada
Shintaro Yamada LUCAS & MERCANTI, LLP100 South Jefferson RoadSuite 202Whippany, NJ 07981Goods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 007 | Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof | ACTIVE | — |
| 037 | Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
- Other trademarks owned by Bondtech Co., Ltd.
- Other trademarks owned by Bondtech Co., Ltd.
- Other trademarks owned by Bondtech Co., Ltd.
- Other trademarks in Class 007
- Other trademarks in Class 037
- Similar marks named BONDTECH
- Recently changed USPTO trademarks
- Recently filed trademarks
- Browse all trademark records
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Sep 3, 2026 | NREP | NEW REPRESENTATIVE AT IB RECEIVED | — |
| Jun 11, 2026 | NREP | NEW REPRESENTATIVE AT IB RECEIVED | — |
| Dec 18, 2025 | TCCA | TEAS CHANGE OF CORRESPONDENCE RECEIVED | — |
| Dec 18, 2025 | ECDR | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS | — |
| Dec 18, 2025 | ARAA | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Dec 18, 2025 | REAP | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | — |
| Apr 4, 2025 | FINO | FINAL DECISION TRANSACTION PROCESSED BY IB | — |
| Mar 14, 2025 | FICS | FINAL DISPOSITION NOTICE SENT TO IB | — |
| Mar 14, 2025 | FIMP | FINAL DISPOSITION PROCESSED | — |
| Jan 8, 2025 | FICR | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | — |
| Oct 8, 2024 | NRCC | NOTICE OF REGISTRATION CONFIRMATION EMAILED | — |
| Oct 8, 2024 | R.PR | REGISTERED-PRINCIPAL REGISTER | Your trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive. |
| Aug 17, 2024 | OPNX | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB | — |
| Jul 31, 2024 | OPNS | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | — |
| Jul 31, 2024 | OPNR | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB | — |
| Jul 23, 2024 | NPUB | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | — |
| Jul 23, 2024 | PUBO | PUBLISHED FOR OPPOSITION | Your mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance. |
| Jul 3, 2024 | NONP | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | — |
| Jun 20, 2024 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Jun 17, 2024 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Jun 17, 2024 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jun 17, 2024 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Jan 9, 2024 | GNRN | NOTIFICATION OF NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jan 9, 2024 | GNRT | NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jan 9, 2024 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Dec 22, 2023 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Dec 21, 2023 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Dec 21, 2023 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Oct 25, 2023 | ATRV | ATTORNEY REVIEW COMPLETED | — |
| Oct 25, 2023 | LIME | LIMITATION FROM THE IB - REQUEST EXAM REVIEW | — |
| Jul 30, 2023 | LIMG | LIMITATION OF GOODS RECEIVED FROM IB | — |
| Jul 26, 2023 | RFNT | REFUSAL PROCESSED BY IB | — |
| Jul 5, 2023 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Jul 5, 2023 | RFRR | REFUSAL PROCESSED BY MPU | — |
| May 23, 2023 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| May 22, 2023 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| May 15, 2023 | DOCK | ASSIGNED TO EXAMINER | — |
| Mar 7, 2023 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Mar 3, 2023 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Mar 2, 2023 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |