USPTO serial 79381747
SILANNA SAFE UV
Reviewed by CopyMark Law Group
- Filing date
- Status date
- Registration date
- —
- Examiner
- BLAZICH, JOAN MICHELE
- Law office
- TMO LAW OFFICE 122
What this means
These status codes mean the trademark application is abandoned and no longer pending. Common reasons include missing an Office Action response (600), filing without a valid basis (602), express abandonment by the applicant (604), or failure to respond to an examiner's inquiry (618). Revival may be possible in limited circumstances. If abandonment was unintentional, consult counsel about a petition to revive. Otherwise file a new application if protection is still needed.
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Owner
Goods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 009 | Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; mechanisms for coin-operated apparatus; cash registers, calculating machines, fire-extinguishing apparatus; circuits; analog circuits; digital and analog signalling devices; high speed isolators; wide band receivers; low noise amplifiers; electronic circuits; electronic integrated circuits; electronic logic circuits; electronic memory circuits; hybrid circuits; hybrid integrated circuits; infrared circuit components; logic circuits; masks for making circuits; microprocessor control circuits; miniature circuit breakers; circuit breakers; circuit cards; circuit closers; circuit distributors; circuit fuses; circuit openers; circuit switches; circuit testers; circuits (electric or electronic); electronic chips (semi-conductors) for the manufacture of integrated circuits; integrated circuits; cards bearing integrated circuits; cards incorporating integrated circuits; cartridges with memory integrated circuits; chips (integrated circuits); silicon on insulator wafers; glass wafers for integrated circuits; integrated circuits for networks for use in identification; masks for making integrated circuits; masks for the production of integrated circuits; photo mask substrates for integrated circuits; plates with integrated circuits; probes for use with integrated circuits (other than for medical use); reading machines for integrated circuits; silicon wafer carriers for handling integrated circuits; sockets for testing integrated circuits; solid-state integrated circuits; test probe assemblies for integrated circuits; test sockets for integrated circuits; thick film hybrid integrated circuits; integrated circuit memories; semi conductors; complementary metal-oxide semiconductors; compound semiconductors; semi conductor memories; semi conductor chips; semi conductor and microprocessor cartridges; semiconductor apparatus; semiconductor apparatus for use with computers; semiconductor devices; semiconductor elements; semiconductor instruments; semiconductor memories; computer programmes; semiconductor memory apparatus; semiconductor memory units; computer programmes; semiconductor memory devices; semiconductor memory instruments; semiconductor wafers; semiconductors (integrated circuits); semiconductors being electronic devices; silicon chips (electronic components); silicon controlled reactors; silicon controlled rectifiers; micro accelerometers; silicon micro accelerometers; silicon rubber layered electrical connectors; silicon slices (wafers); silicon wafer slices; silicon wafers; wafers (silicon slices); processors; microprocessors; microcontrollers; static RAM; digital logic circuits; equipment for testing and programming integrated circuits; catalyst substrates for use in signalling apparatus; flexible circuit substrates having controlled impedance characteristics; flexible printed circuits incorporating substrates; glass substrates for magnetic recording media; photomask substrates for integrated circuits; printed circuits on substrates of flexible film; printed circuits on substrates of plastics material; printed substrates for printed circuit boards; recording substrates (magnetic); recording substrates (optical); special glass carrier substrates for biologically significant substances for magnetic recording devices; substrates (printed circuit boards) ready for etching; substrates (wafers); substrates for carrying information in electronic form; substrates for carrying information in magnetic form; substrates for carrying information in optical form; substrates for holographs; substrates for photographs (exposed); substrates for photographs (unexposed); apparatus for connecting electrical circuit components; apparatus for testing electronic circuits; apparatus for testing printed circuit boards; apparatus for the exposure of films for integrated circuits; light emitting diodes (LED); light emitting diodes (LED) for use in scientific and manufacturing equipment; light emitting diodes (LED) for high energy light; parts, fittings, accessories, components and testing apparatus for all the aforesaid goods | ACTIVE | — |
| 040 | Customised materials assembly for others; custom manufacture of chips; custom manufacture of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the custom manufacture of semiconductor materials and devices; consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing | ACTIVE | — |
| 042 | Scientific and technological services and research and design relating thereto; industrial analysis and research services; research, engineering, design and development of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; foundry services related to design of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; engineering project management services; management of scientific research projects; project management (design); research, engineering, design and development of microelectronic devices; design services for others; design of electric circuit boards; analysis of materials; industrial analysis; laboratory services; laboratory services (scientific research or analysis); materials characterisation analysis; technological engineering analysis; technological analysis services; scientific and technical analysis; engineering project management of testing, packaging and assembly services; prototype design services; research, engineering, design and development of light emitting diodes (LED); testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices; engineering service in the field of semiconductor materials and devices; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices; foundry services related to design of light emitting diodes (LED); consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Apr 12, 2025 | OPNX | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB | — |
| Mar 25, 2025 | OPNS | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | — |
| Mar 25, 2025 | OPNR | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB | — |
| Nov 12, 2024 | MAB2 | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND | The trademark application was abandoned because a required response or document was not filed by the deadline — usually a missed Office Action response. The application is dead unless a petition to revive is granted within a limited time. |
| Nov 12, 2024 | ABN2 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | The trademark application was abandoned because a required response or document was not filed by the deadline — usually a missed Office Action response. The application is dead unless a petition to revive is granted within a limited time. |
| May 22, 2024 | RFNT | REFUSAL PROCESSED BY IB | — |
| Apr 27, 2024 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Apr 27, 2024 | RFRR | REFUSAL PROCESSED BY MPU | — |
| Apr 16, 2024 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Apr 15, 2024 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Apr 10, 2024 | DOCK | ASSIGNED TO EXAMINER | — |
| Oct 31, 2023 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Oct 27, 2023 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Oct 26, 2023 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |