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Drawing for CHOSHU

USPTO serial 79418193

CHOSHU

Reviewed by CopyMark Law Group

Reg. 8208756Status 700Registered
Filing date
Status date
Registration date
Apr 14, 2026
Examiner
LATTUCA, FRANK J
Law office
FILE REPOSITORY (FRANCONIA)

What this means

Status 700 means the trademark is registered and active on the Principal Register. You have nationwide rights for the listed goods and services and may use ®. Section 8 maintenance is due between years five and six. Calendar Section 8 between years five and six, and consider trademark monitoring.

Status 700: Status 700 means the trademark is registered and active on the Principal Register. You have nationwide rights for the listed goods and services and may use ®. Section 8 maintenance is due between years five and six.

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Owner

Attorney of record

The USPTO lists this attorney as the applicant's representative for correspondence on this application.

M. Scott Alprin

M. Scott Alprin ALPRIN LAW OFFICES, P.C.5 Pinehurst Circle, N.W.Washington, DC 20015United States

Goods and services

ClassDescriptionStatusFirst use
007Hydrogen production equipment namely electrolysis machines for generating hydrogen; chemical processing machines and apparatus; Hydrogen station equipment, namely, hydrogen supplying machines for service stations; Fuel supply system comprised of fuel dispensing machines, namely, fuel dispensing machines for vehicles and its components; AC electric motors and DC electric motors and their parts not including those for land; Alternators; direct current generators; Hydrogen-powered gas turbine generator; Hydrogen-based boiler power generation equipment namely generators; Semiconductor manufacturing equipment, namely, wafer processing machines, photolithography systems comprised of steppers and coater-developers, etching machines for etching conductive films, insulating films, semiconductor films, oxide films, and nitride films, ion implantation machines, deposition machines for depositing conductive films, insulating films, semiconductor films, and diffusion barrier films, cleaning machines for removing particles, organic residues, metal residues, and chemical residues from semiconductor wafers, chemical mechanical polishing machines, semiconductor testing machines, and their structural replacement parts; Organic light-emitting diode manufacturing equipment, namely, substrate cleaning machines, chemical vapor deposition systems, organic material deposition equipment comprised of load lock chambers, degas chambers, deposition chambers, and mask alignment chambers, patterning machines for forming thin films including organic layers, electrode layers, and encapsulation layers into predetermined patterns, and etching machines for selectively removing unwanted portions of transparent electrodes, metal films, and insulating films, encapsulation machines for encapsulating light-emitting devices including organic layers and electrodes, and thin-film encapsulation systems, deposition mask alignment equipment comprised of mask holding mechanisms, substrate stages, position adjustment mechanisms, drive mechanisms, optical alignment sensors, gap control mechanisms, and control computers, inspection and testing machines for inspecting and testing electrical characteristics, optical characteristics, dimensional accuracy, positional accuracy, and encapsulation integrity of organic light-emitting diode devices, and control units for controlling operation of manufacturing equipment, process conditions, material handling, interlock functions, and monitoring functions in organic light-emitting diode manufacturing processes; Manufacturing equipment for organic electroluminescent display devices, namely, substrate handling robots, thin-film encapsulation equipment for forming encapsulation layers to protect organic electroluminescent materials from moisture and external environment during manufacturing, mask alignment systems, organic material deposition equipment for depositing organic thin-film materials including light-emitting layers and charge transport layers of organic electroluminescent devices on substrates, inspection modules for inspecting film deposition quality including film thickness and uniformity, patterning accuracy, electrical characteristics, and optical characteristics, and their structural replacement parts; LCD panel manufacturing equipment, namely, substrate cleaning machines, alignment machines, liquid crystal injection machines, sealing machines for sealing liquid crystal materials between glass substrates with sealing materials, inspection machines for inspecting display defects including pixel defects, luminance non-uniformity and color non-uniformity, electrical characteristics including wiring disconnection and short circuits, thin film transistor on/off characteristics, driving voltage and leakage current, and appearance defects including scratches, contamination, and foreign matter, and their structural replacement parts; Semiconductor thin film formation equipment, namely, chemical vapor deposition machines, physical vapor deposition machines, atomic layer deposition machines, sputtering machines, epitaxial growth reactors, and their structural replacement parts; Vacuum thin film forming equipment, namely, vacuum evaporation systems comprised of vacuum chamber units, evacuation and vacuum system units, evaporation source units, substrate holding and transfer units, patterning and deposition control units, film thickness and process control units, and material supply and preheating and drying units, sputtering systems comprised of vacuum chamber units, evacuation and vacuum system units, gas introduction and pressure control units, plasma generation and power supply units, target and cathode units, substrate stage and transfer units, film thickness and process control units, and shielding units, molecular beam epitaxy chambers, ion plating apparatus, and their structural replacement parts; Vacuum deposition equipment, namely, vacuum coating machines, vacuum plating machines, ion plating machines, and their structural replacement parts; Molecular launcher machines for thin film deposition in semiconductor manufacturing; Sputtering equipment, namely, magnetron sputtering machines, DC and RF sputtering systems, batch and in-line sputter deposition machines, and their structural replacement parts; Ultrasonic cleaning equipment, namely, ultrasonic bath cleaners, ultrasonic spray cleaning systems comprised of cleaning chambers, ultrasonic oscillation units, spray supply units, cleaning liquid supply and circulation units, wafer transfer and holding units, cleaning process control units, drying units, and waste liquid and exhaust units, transducer-based cleaning systems comprised of cleaning tank units, transducer units, ultrasonic oscillation units, cleaning liquid supply and circulation units, wafer transfer and holding units, control units, drying units, and waste liquid and exhaust units, and their structural replacement parts; Manufacturing equipment for electronic circuit boards, namely, PCB etching machines, solder mask application systems comprised of board transfer and positioning units, surface cleaning units, resist supply units, coating units, film thickness and coating quality control units, exposure units, developing units, drying units, control units, and exhaust and waste liquid treatment units, drilling and routing machines, pick-and-place machines for picking electronic components including chip resistors, capacitors, integrated circuits, transistors, diodes, LEDs, and sensor components and placing the picked electronic components onto predetermined mounting positions on circuit boards, reflow soldering ovens, and their structural replacement parts; Plasma etching equipment, namely, dry etching machines, reactive ion etching machines, deep reactive ion etching machines, plasma ashing systems comprised of plasma sources, reaction chambers, gas supply units, exhaust units, transfer units, temperature control units, and process control and monitoring units, and structural replacement parts therefor, for use in semiconductor manufacturing; Gate valves for vacuum deposition equipment used in semiconductor manufacturing; Semiconductor manufacturing equipment, namely, jigs and fixtures for holding wafers, substrates, or components during processing, assembly, testing, or transport; Semiconductor manufacturing equipment, namely, alignment fixtures for aligning wafers during semiconductor manufacturing processes, polishing and dicing blades being machine parts for use in semiconductor wafer polishing and dicing machines, and calibration tools and modules for calibrating semiconductor manufacturing equipmentACTIVE—
009Solar Cell; Solar panel for the production of electricity; photovoltaic modules; Photovoltaic installation apparatus, namely, photovoltaic solar modules for production of electricity, solar thermal and electric receivers, tracking mechanisms and concentrating optics, and control algorithms; Fuel cells; accumulators, electric; Electrical junction box for solar power generation equipment; Solar power generation inverter; Power line conditioner for solar power generation equipment; Power indicator for solar power generation equipment; organic light-emitting diodes; Organic light-emitting diode (OLED) display devices, namely, OLED panels, OLED display modules, and their structural replacement parts; Electron guns, namely, electron beam heating guns for use in electron beam evaporation for vacuum depositionACTIVE—
011Chiller units for industrial equipment; Thin film deposition crucibles for industrial purposes; Vacuum drying equipment, namely, vacuum ovens, vacuum freeze dryers, and vacuum dryers; Solar cell-powered lighting fixturesACTIVE—
037Repair or maintenance of hydrogen production equipment and its parts; Repair or maintenance of hydrogen station equipment and its parts; Repair or maintenance of fuel supply systems and parts thereof for passenger vehicles; repair or maintenance of AC motors and DC motors and their parts, excluding AC motors and DC motors for land vehicles and excluding their parts; Repair or maintenance of alternators and their parts; Repair or maintenance of DC generators and their parts; Repair or maintenance of hydrogen-based gas turbine power generation equipment and its parts; Repair or maintenance of biomass power generation equipment and its parts; Battery repair or maintenance; Installation, repair and maintenance of solar power generation equipment; Repair or maintenance of semiconductor manufacturing equipment and its parts; Repair or maintenance of LCD panel manufacturing equipment and its parts; Repair or maintenance of organic light-emitting diode manufacturing equipment and its parts; Repair or maintenance of manufacturing equipment for organic EL displays and their parts; Repair or maintenance of manufacturing equipment for electronic circuit boards and parts thereof; repair and maintenance of vacuum pumpsACTIVE—
040Recycling of used parts of manufacturing equipment for electronic devices; recycling process, namely, recovery of valuable materials from semiconductor manufacturing equipment; recycling process, namely, recovery of valuable materials from used solar cells; custom manufacture of semiconductor devices for others; Semiconductor wafer cutting and grinding services, namely, precision wafer dicing, back grinding, thinning, and polishing of semiconductor wafers; semiconductor wafer cleaning, namely, chemical cleaning, plasma cleaning, mega sonic, and ultrasonic cleaning of semiconductor wafers; metal processing for vacuum equipment parts, namely, precision machining, milling, turning machining, grinding, and polishing of metal components used in vacuum equipment; metalworkingACTIVE—

Related trademarks

CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
Oct 15, 2026FINOFINAL DECISION TRANSACTION PROCESSED BY IB—
Oct 14, 2026OPNSNOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB—
Oct 14, 2026OPNRNOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB—
Sep 25, 2026FICSFINAL DISPOSITION NOTICE SENT TO IB—
Sep 25, 2026FIMPFINAL DISPOSITION PROCESSED—
Jul 14, 2026FICRFINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB—
Apr 14, 2026NRCCNOTICE OF REGISTRATION CONFIRMATION EMAILED—
Apr 14, 2026R.PRREGISTERED-PRINCIPAL REGISTERYour trademark is registered on the Principal Register — the strongest form of federal trademark protection. You may use the ® symbol for the covered goods and services. Maintenance filings (Section 8 and renewals) are required to keep the registration alive.
Feb 25, 2026CORNCORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED—
Feb 24, 2026NPUBOFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED—
Feb 24, 2026PUBOPUBLISHED FOR OPPOSITIONYour mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance.
Feb 18, 2026NONPNOTIFICATION OF NOTICE OF PUBLICATION E-MAILED—
Feb 1, 2026CNSAAPPROVED FOR PUB - PRINCIPAL REGISTER—
Jan 30, 2026TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
Jan 30, 2026CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
Jan 30, 2026TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
Aug 23, 2025RFNTREFUSAL PROCESSED BY IB—
Aug 2, 2025RFCSNON-FINAL ACTION MAILED - REFUSAL SENT TO IB—
Aug 2, 2025RFRRREFUSAL PROCESSED BY MPU—
Jun 12, 2025RFCRNON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW—
Jun 11, 2025CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Jun 10, 2025DOCKASSIGNED TO EXAMINER—
May 16, 2025CRCVCORRECTION TRANSACTION RECEIVED FROM IB—
Feb 28, 2025MAFRAPPLICATION FILING RECEIPT MAILED—
Feb 28, 2025NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED—
Feb 27, 2025REPRSN ASSIGNED FOR SECT 66A APPL FROM IB—

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