Drawing for FLOWLASE

USPTO serial 79440359

FLOWLASE

Reviewed by CopyMark Law Group

Status 661
Filing date
Status date
Registration date
—
Examiner
GILBERT, HANNAH B
Law office
TMO LAW OFFICE 121

What this means

This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.

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Owner

Attorney of record

The USPTO lists this attorney as the applicant's representative for correspondence on this application.

Maurine Knutsson

Maurine Knutsson Knutsson IP ABNelinsgatan 14Norrkoping, 603 45Sweden

Goods and services

ClassDescriptionStatusFirst use
009Scientific research and laboratory apparatus, namely, high-temperature chemical vapor deposition (HTCVD) device, physical vapor transport (PVT) devices, crystal growing furnaces, pullers, and reactors, melt growth systems, and wafer manufacturing equipment; educational apparatus and simulators, namely, high-temperature chemical vapor deposition (HTCVD) device, physical vapor transport (PVT) devices, crystal growing furnaces, pullers, and reactors, melt growth systems, and wafer manufacturing equipment; measuring, detecting, monitoring and controlling devices, namely, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers; testing and quality control devices, namely, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers; scientific, research, surveying, optical, weighing, measuring, signaling, detecting, testing, inspecting, and teaching apparatus and instruments, namely, high-temperature chemical vapor deposition (HTCVD) device, physical vapor transport (PVT) devices, crystal growing furnaces, pullers, and reactors, melt growth systems, wafer manufacturing equipment, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers; semiconductor devices; integrated circuits, semiconductor chips, and wafers; semiconductors; semiconductor testing apparatus; electronic components in the nature of electric contactors; transistors, diodes, and electric resistors; downloadable computer software for use in processing semiconductor wafers; recorded computer software for use in processing semiconductor wafers; downloadable computer software for the testing, analysis, production, manufacture, operation, and optimization of semiconductors, microelectronics, nanotechnology, semiconductor discs and circuits, crystal growth for semiconductors, SiC crystals, silicon carbide crystals, printed circuit boards, substrates, computer chips, electrical and electronic components, integrated circuits and transistors, and silicon wafers; recorded computer software for the testing, analysis, production, manufacture, operation, and optimization of semiconductors, microelectronics, nanotechnology, semiconductor discs and circuits, crystal growth for semiconductors, SiC crystals, silicon carbide crystals, printed circuit boards, substrates, computer chips, electrical and electronic components, integrated circuits and transistors, and silicon wafers; downloadable computer software for photolithography, microlithography, and electronic design automation (EDA); recorded computer software for photolithography, microlithography, and electronic design automation (EDA); downloadable software for designing and simulating semiconductor devices; recorded software for designing and simulating semiconductor devices; downloadable software used for simulating and optimizing the crystal growth process; recorded software used for simulating and optimizing the crystal growth process; downloadable software for monitoring, analysing, controlling and running physical world operations of semiconductors, microelectronics, nanotechnology, semiconductor discs and circuits, crystal growth for semiconductors, SiC crystals, silicon carbide crystals, printed circuit boards, substrates, computer chips, electrical and electronic components, integrated circuits and transistors, silicon wafers, photolithography, microlithography, and electronic design automation (EDA); recorded software for monitoring, analysing, controlling and running physical world operations of semiconductors, microelectronics, nanotechnology, semiconductor discs and circuits, crystal growth for semiconductors, SiC crystals, silicon carbide crystals, printed circuit boards, substrates, computer chips, electrical and electronic components, integrated circuits and transistors, silicon wafers, photolithography, microlithography, and electronic design automation (EDA); scientific instruments, namely, high-temperature chemical vapor deposition (HTCVD) device, physical vapor transport (PVT) devices, crystal growing furnaces, pullers, and reactors, melt growth systems, wafer manufacturing equipment, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers; apparatus, namely, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers for testing and measuring semiconductor materials; apparatus, namely, x-ray diffractometers, infrared cameras, furnace load cells, optical defect inspection systems, atomic force microscopes, scanning electron microscopes, capacitive gauges, optical gauges, four-point probe meters, electron beam inspection devices, ellipsometers, profilometers, particle counters, chemical purity analyzers, scanning electron microscopes, and system-on-chip (SoC) testers for testing and measuring the quality and properties of the grown SiC crystals; equipment for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electricity limiters, electricity meters, electricity conduits, electricity distribution consoles, electrical switches, electrical transformers; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity and electric current; equipment for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricityACTIVE—

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CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.

Prosecution history

DateCodeEventWhat it means
May 31, 2026TEMETEAS/EMAIL CORRESPONDENCE ENTERED—
May 31, 2026CRFACORRESPONDENCE RECEIVED IN LAW OFFICE—
May 31, 2026TROATEAS RESPONSE TO OFFICE ACTION RECEIVEDThis event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action.
Apr 2, 2026RFNTREFUSAL PROCESSED BY IB—
Mar 19, 2026RFCSNON-FINAL ACTION MAILED - REFUSAL SENT TO IB—
Mar 19, 2026RFRRREFUSAL PROCESSED BY MPU—
Feb 13, 2026RFCRNON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW—
Feb 12, 2026CNRTNON-FINAL ACTION WRITTENA non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application.
Jan 24, 2026DOCKASSIGNED TO EXAMINER—
Jan 23, 2026MAFRAPPLICATION FILING RECEIPT MAILED—
Jan 23, 2026NWOSNEW APPLICATION OFFICE SUPPLIED DATA ENTERED—
Jan 18, 2026LIMILIMITATION FROM ORIGINAL APPLICATION ENTERED—
Jan 1, 2026REPRSN ASSIGNED FOR SECT 66A APPL FROM IB—

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