USPTO serial 79452201
CUPRIMA
Reviewed by CopyMark Law Group
- Filing date
- Status date
- Registration date
- —
- Examiner
- BROWN, TINA
- Law office
- TMO LAW OFFICE 118
What this means
Status 680 means the examining attorney approved your mark for publication in the USPTO Official Gazette. Publication for opposition usually follows within weeks, opening a 30-day window for third parties to oppose. Watch for publication (status 686) and monitor the 30-day opposition window.
Need help with CUPRIMA?
If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.
Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.
Owner
Attorney of record
The USPTO lists this attorney as the applicant's representative for correspondence on this application.
Constance B. Stefanou
Constance B. Stefanou Morgan, Lewis & Bockius LLP1111 Pennsylvania Avenue, NWAttn: TMSUWashington, DC 20004Goods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 001 | Adhesives for use in the manufacture of electronic components; tacking agent, namely, temporary fixing adhesives in the nature of temporary adhesives for industrial purposes; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components, namely, temporary adhesives for use in manufacturing electronic components; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors, namely, temporary fixing adhesives for use in the manufacture of electronic components and semiconductors | ACTIVE | — |
| 006 | Solder pastes, namely, powder of copper in the form of pastes used in bonding and sintering processes of electronic components; solder preforms, namely, copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; solder pastes, namely, powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; solder preforms, namely, copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; solder preforms, namely, preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; solder pastes, namely, powder of copper in the form of pastes used for sinter joining | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Oct 8, 2026 | RFNT | REFUSAL PROCESSED BY IB | — |
| Oct 5, 2026 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Oct 1, 2026 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Oct 1, 2026 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Oct 1, 2026 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Sep 21, 2026 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Sep 21, 2026 | RFRR | REFUSAL PROCESSED BY MPU | — |
| Jul 17, 2026 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Jul 16, 2026 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jul 13, 2026 | DOCK | ASSIGNED TO EXAMINER | — |
| Jun 30, 2026 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Jun 30, 2026 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Jun 30, 2026 | LIMI | LIMITATION FROM ORIGINAL APPLICATION ENTERED | — |
| Jun 18, 2026 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |