USPTO serial 79452888
Reviewed by CopyMark Law Group
The USPTO has issued an Office Action on this application. A response is typically required before the deadline, or the application can be abandoned.
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| Class | Description | Status | First use |
|---|---|---|---|
| 009 | Electric and electronic components; electrical circuits and printed circuit boards; III-V thin-film devices; wafers for integrated circuits; coolers for electronic components; photonic chips; photonic integrated circuits (PICs); indium phosphide chips and semiconductors; III-V semiconductors; chips for integrated circuits; semiconductor lasers; microprocessors; semi-conductor devices; semi-conductor chips; semiconductor modules; semiconductor substrates; semiconductor sensors; semiconductor transistors; thin-film materials, namely thermally conductive, optical, and electrically functional layers for application on semiconductors, optical components, and wafers; thin-film devices manufactured from III-V materials, with thermal functions, including for applications in photonics, radio frequency, and power electronics; electronic and optoelectronic components with integrated thin-film layers for thermal management or signal processing; integrated circuits (ICs); interfaces; electronic chips for the manufacture of integrated circuits. | ACTIVE | — |
| 040 | Material processing on wafers, semiconductors, and optical components, including the application of thin-film layers; processing of semiconductor wafers; semiconductor encapsulation; applying a thin film layer to optical components; processing of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; customer-specific manufacturing of semiconductor wafers, semiconductor circuits, semiconductor components, devices, and circuits. | ACTIVE | — |
| 042 | Scientific and technological services; product development; designing semiconductor chips; research and development of photonic products; research in the field of semiconductor processing technology; consultancy, design, research, development, production and advisory services related thereto in the field of semiconductor chips; technical advice regarding the production of semiconductors; research and development of substrate removal processes, thin-film coating processes, thermal integration, and management of electrical and electronic components; development and implementation of thermally, optically and electrically functional thin-film materials; designing semiconductor chips, lasers, transistors, PICs and integral circuits; technical research and consultancy related thereto in the field of the manufacturing of photonic silicon chips; development of software for (photonic) semiconductors; development of software for simulation, analysis, and process control of thin-film technology and thermal management. | ACTIVE | — |
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
| Date | Code | Event | What it means |
|---|---|---|---|
| Oct 8, 2026 | RFNT | REFUSAL PROCESSED BY IB | — |
| Sep 23, 2026 | RFCS | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | — |
| Sep 23, 2026 | RFRR | REFUSAL PROCESSED BY MPU | — |
| Jul 18, 2026 | RFCR | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | — |
| Jul 17, 2026 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jul 13, 2026 | DOCK | ASSIGNED TO EXAMINER | — |
| Jun 30, 2026 | MAFR | APPLICATION FILING RECEIPT MAILED | — |
| Jun 30, 2026 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Jun 25, 2026 | REPR | SN ASSIGNED FOR SECT 66A APPL FROM IB | — |