USPTO serial 87187723
YOUTEC SUPPORT AND SERVICE
Reviewed by CopyMark Law Group
Status 606
- Filing date
- Status date
- Registration date
- —
- Examiner
- HERMAN, RUSS
- Law office
- INTENT TO USE SECTION
What this means
This page summarizes the public USPTO record for this serial number, including owners, goods and services, and prosecution history.
Need help with YOUTEC SUPPORT AND SERVICE?
If you own this trademark, we can monitor new filings and help with USPTO deadlines. If you do not, we can file a new U.S. application.
Current trademark owner
Monitor this mark, or talk with CopyMark about this registration.
Not the owner?
File a new U.S. trademark application, or speak with our attorneys.
Owner
Chiba 270-0156, JP
Chiba 270-0156, JP
Attorney of record
The USPTO lists this attorney as the applicant's representative for correspondence on this application.
Rebeccah Gan
REBECCAH GAN WENDEROTH, LIND & PONACK, LLP1030 15TH STREET, N.W.SUITE 400 EASTWASHINGTON, DC 20005Goods and services
| Class | Description | Status | First use |
|---|---|---|---|
| 001 | (Based on Sections 1(b) and 44(e)): Conductive resin material, namely, unprocessed synthetic resins for use as an electrical conductor in the manufacture of semiconductors | ACTIVE | — |
| 007 | (Based on Section 1(b) only): Electronic components, namely, semiconductor wafers for use in the manufacture of semiconductors; Semiconductor manufacturing apparatus and systems, namely, semiconductor substrates and semiconductor wafers and parts thereof; Chemical processing machines, namely, separating machines, dissolving machines, extracting machines and parts thereof; Metalworking machines, namely, boring machines, bending machines, cutting machines and parts thereof; Plastic processing machines and parts thereof; Chemical processing machines for industrial use and parts thereof; Apparatus for forming thin film coatings for use in the manufacture of semiconductors and for processing metal surfaces and insulating materials, and parts thereof; Apparatus for depositing thin film coatings on metal surfaces by chemical vapor deposition processing and parts thereof; Apparatus for forming thin films for use in the manufacture of semiconductors using a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on plastic surfaces through a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on glass surfaces by a chemical vapor deposition process, and parts thereof; Industrial apparatus for processing ion plating applications of metal surfaces and parts thereof; Industrial apparatus for processing ion plating applications for use in semiconductor manufacturing and parts thereof; Industrial apparatus for processing ion plating applications for plastic surfaces, and parts thereof; Industrial apparatus for processing ion plating applications for glass surfaces, and parts thereof; Sputtering apparatus for metal surface processing and parts thereof, for industrial use; Sputtering apparatus for semiconductor manufacturing and parts thereof; Sputtering apparatus for plastic surface processing and parts thereof, for industrial use; Sputtering apparatus for glass surface processing and parts thereof, for industrial use; Etching apparatus for metal surface processing and parts thereof, for industrial use; Etching apparatus for semiconductor manufacturing and parts thereof; Etching apparatus for plastic surface processing and parts thereof, for industrial use; Etching apparatus for glass surface processing and parts thereof, for industrial use; Vacuum evaporation apparatus for surface treatment of semiconductors and parts thereof; Vacuum evaporation processing apparatus for treatment of metal surfaces of semiconductor components, and parts thereof; Vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Vacuum evaporation apparatus for plastic surface processing of semiconductor components, and parts thereof; Vacuum evaporation processing apparatus for use on glass surfaces of semiconductor components, and parts thereof; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean substrates such as semiconductor or glass substrates by blowing dust particles of the substrate surface, organic matter of the substrate surface or burrs which occur during micro-process on the substrate surface while scanning the carbon dioxide particles from the spray nozzle to the substrate; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean products such as electronic or semiconductor products by blowing dust particles of the product surface, organic matter of the product surface or burrs which occur during micro-process on the product surface while scanning the carbon dioxide particles from the spray nozzle to the product | ACTIVE | — |
| 009 | (Based on Sections 1(b) and 44(e)): Electronic components, namely, piezoelectric switches and digital transmitters; Integrated electronic circuits and parts thereof; Power line electrical communication systems for transferring broadband data over electrical power lines comprised of computer hardware, software and modems; Electronic machines for identifying surface thickness of thin film applications to semiconductor components and applying film applications to semiconductor components; Conductive material, namely, semiconductor wafers, light conducting filaments, insulated copper wire; Ionic solutions for providing conductivity for use in semiconductor manufacturing; Conductive material sprays incorporating ionic solutions for use in semiconductor manufacturing; Conductive paste incorporating ionic solutions for use in semiconductor manufacturing | ACTIVE | — |
| 021 | (Based on Sections 1(b) and 44(e)): Household containers for food; Dishware or dinnerware | ACTIVE | — |
| 037 | (Based on Sections 1(b) and 44(e)): Repair and maintenance of machines for use in the manufacture of electronic semiconductor components; Repair and maintenance of semiconductor manufacturing machines; Repair and maintenance of chemical processing machines; Repair and maintenance of metalworking machines; Repair and maintenance of plastic processing machines; Repair and maintenance of industrial machines used to process physical properties of matter and energy, as well as chemical properties; Repair and maintenance of machines for depositing thin films of synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for metal surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition for semiconductor manufacturing; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for plastic surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for glass surface; Repair and maintenance of ion plating apparatus for metal surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for semiconductor manufacturing; Repair and maintenance of ion plating apparatus for plastic surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for glass surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for metal surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for semiconductor manufacturing; Repair and maintenance of sputtering apparatus for plastic surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for glass surface processing of semiconductor components; Repair and maintenance of etching apparatus for metal surface processing; Repair and maintenance of etching apparatus for semiconductor manufacturing; Repair and maintenance of etching apparatus for plastic surface processing; Repair and maintenance of etching apparatus for glass surface processing; Repair and maintenance of vacuum evaporation apparatus for use in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for metal surface preprocess in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for plastic surface processing of semiconductor components; Repair and maintenance of vacuum evaporation apparatus for glass surface processing of semiconductor components | ACTIVE | — |
| 040 | (Based on Sections 1(b) and 44(e)): Process coating of semiconductor components for others using thin film synthetic polymers (Based on Section 1(b) only): Processing and assembling of electronic components for the semiconductor manufacturing industry; Processing and assembly of electronic circuits and parts thereof for others; Processing and assembly of electrical communication components for the semiconductor manufacturing industry; Processing and assembly of electronic machines for use in the semiconductor manufacturing industry; Custom manufacture of machines for manufacturing electronic semiconductor components; Custom manufacture of semiconductor manufacturing machines and parts thereof; Custom manufacture of chemical processing machines and parts thereof; Custom manufacture of metalworking machines and parts thereof; Custom manufacture of plastic processing machines and parts thereof; Custom manufacture of industrial machines used to process physical properties of matter and energy, as well as chemical properties and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for glass surface processing, and parts thereof; Custom manufacture of ion plating apparatus for metal surface processing and parts thereof; Custom manufacture of ion plating apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of ion plating apparatus for plastic surface processing and parts thereof; Custom manufacture of ion plating apparatus for glass surface processing and parts thereof; Custom manufacture of sputtering apparatus for metal surface processing and parts thereof; Custom manufacture of sputtering apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of sputtering apparatus for plastic surface processing and parts thereof; Custom manufacture of sputtering apparatus for glass surface processing and parts thereof; Custom manufacture of etching apparatus for metal surface processing and parts thereof; Custom manufacture of etching apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of etching apparatus for plastic surface processing and parts thereof; Custom manufacture of etching apparatus for glass surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for industrial surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for metal surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of vacuum evaporation apparatus for plastic surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for glass surface processing and parts thereof; Custom manufacture of cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank, and replacement parts therefore | ACTIVE | — |
| 042 | (Based on Sections 1(b) and 44(e): Advisory and consultancy services relating to the design of electronic components manufacturing machines for use in the semiconductor industry; Advisory and consultancy services relating to the design of semiconductor manufacturing machines and systems; Advisory and consultancy services relating to the design of chemical processing machines and apparatus; Advisory and consultancy services relating to the design of metalworking machines and apparatus; Advisory and consultancy services relating to the design of plastic processing machines and apparatus; Advisory and consultancy services relating to the design of industrial machines used to process physical properties of matter and energy, as well as chemical properties; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers on semiconductor components, metal surfaces and electrical insulating materials; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing; Advisory and consultancy services relating to the design of machines for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing; Advisory and consultancy services relating to the design of machines for depositing thin films by chemical vapor deposition for glass surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for metal surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of ion plating apparatus for plastic surface processing; Advisory and consultancy services relating to the design of ion plating apparatus for glass surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for metal surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of sputtering apparatus for plastic surface processing; Advisory and consultancy services relating to the design of sputtering apparatus for glass surface processing; Advisory and consultancy services relating to the design of etching apparatus for metal surface processing; Advisory and consultancy services relating to the design of etching apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of etching apparatus for plastic surface processing; Advisory and consultancy services relating to the design of etching apparatus for glass surface processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for use in semiconductor processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for metal surface processing in the semiconductor industry; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for semiconductor manufacturing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for plastic surface processing; Advisory and consultancy services relating to the design of vacuum evaporation apparatus for glass surface processing; all of the above noted advisory and consultancy services provided to the order and/or specification of others | ACTIVE | — |
| 045 | (Based on Sections 1(b) and 44(e)): Licensing of intellectual property rights | ACTIVE | — |
Related trademarks
CopyMark links this record to cited §2(d) serials, the owner's other marks, Nice classes, similar mark names, and recently changed USPTO applications.
- Other trademarks owned by YOUTEC CO., LTD.
- Other trademarks owned by YOUTEC CO., LTD.
- Other trademarks in Class 001
- Other trademarks in Class 007
- Other trademarks in Class 009
- Other trademarks in Class 021
- Other trademarks in Class 037
- Other trademarks in Class 040
- Other trademarks in Class 042
- Other trademarks in Class 045
- Similar marks named YOUTEC SUPPORT AND SERVICE
- Prosecution event MAB6 explained
- Recently changed USPTO trademarks
- Recently filed trademarks
- Browse all trademark records
Prosecution history
| Date | Code | Event | What it means |
|---|---|---|---|
| Jan 14, 2019 | MAB6 | ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED | The intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window. |
| Jan 14, 2019 | ABN6 | ABANDONMENT - NO USE STATEMENT FILED | The intent-to-use application was abandoned because no acceptable Statement of Use (or valid extension) was filed before the Notice of Allowance deadline expired. The application is dead unless revived within a limited window. |
| Jun 12, 2018 | NOAM | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | A Notice of Allowance means your intent-to-use application cleared examination and opposition but is not registered yet. You must file a Statement of Use showing the mark in commerce, or request an extension, before the deadline — usually six months from the notice date. |
| Apr 17, 2018 | NPUB | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | — |
| Apr 17, 2018 | PUBO | PUBLISHED FOR OPPOSITION | Your mark was published in the USPTO Official Gazette for a 30-day opposition window. During that period, third parties who believe they would be harmed can file an opposition. If no opposition is filed, prosecution usually continues toward registration or a Notice of Allowance. |
| Mar 28, 2018 | NONP | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | — |
| Mar 13, 2018 | FIXD | ELECTRONIC RECORD REVIEW COMPLETE | — |
| Mar 9, 2018 | ERRR | ON HOLD - ELECTRONIC RECORD REVIEW REQUIRED | — |
| Mar 4, 2018 | CNSA | APPROVED FOR PUB - PRINCIPAL REGISTER | — |
| Mar 2, 2018 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Mar 2, 2018 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Feb 28, 2018 | ALIE | ASSIGNED TO LIE | — |
| Feb 26, 2018 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Feb 12, 2018 | GNRN | NOTIFICATION OF NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Feb 12, 2018 | GNRT | NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Feb 12, 2018 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Feb 1, 2018 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Jan 31, 2018 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jan 31, 2018 | ERSI | TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED | — |
| Jan 26, 2018 | GNS2 | NOTIFICATION OF INQUIRY AS TO SUSPENSION E-MAILED | — |
| Jan 26, 2018 | GNSI | INQUIRY TO SUSPENSION E-MAILED | — |
| Jan 26, 2018 | CNSI | SUSPENSION INQUIRY WRITTEN | — |
| Jan 17, 2018 | RCCK | SUSPENSION CHECKED - TO ATTORNEY FOR ACTION | — |
| Jan 11, 2018 | ALIE | ASSIGNED TO LIE | — |
| Jun 7, 2017 | GNS3 | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED | — |
| Jun 7, 2017 | GNSL | LETTER OF SUSPENSION E-MAILED | — |
| Jun 7, 2017 | CNSL | SUSPENSION LETTER WRITTEN | — |
| Jun 3, 2017 | TEME | TEAS/EMAIL CORRESPONDENCE ENTERED | — |
| Jun 2, 2017 | CRFA | CORRESPONDENCE RECEIVED IN LAW OFFICE | — |
| Jun 2, 2017 | TROA | TEAS RESPONSE TO OFFICE ACTION RECEIVED | This event means the applicant filed a response to a USPTO Office Action — typically arguments, amendments, or evidence addressing the examiner's objections. The USPTO will review the response and either allow the mark to proceed or issue another action. |
| Jan 9, 2017 | GNRN | NOTIFICATION OF NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jan 9, 2017 | GNRT | NON-FINAL ACTION E-MAILED | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jan 9, 2017 | CNRT | NON-FINAL ACTION WRITTEN | A non-final Office Action means the USPTO examining attorney has raised at least one issue with your trademark application but has not made a final decision. You usually have three months to respond with arguments, amendments, or evidence. Missing the deadline can abandon the application. |
| Jan 6, 2017 | DOCK | ASSIGNED TO EXAMINER | — |
| Oct 5, 2016 | MDSM | NOTICE OF DESIGN SEARCH CODE E-MAILED | — |
| Oct 4, 2016 | NWOS | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | — |
| Oct 3, 2016 | NWAP | NEW APPLICATION ENTERED | — |